The 26th International Meshing Roundtable (IMR) solicits technical papers and research notes that present original results on meshing, gridding and related technology. We encourage theoretical and novel ideas and algorithms with practical potential as well as technical applications in science and engineering, geometric modeling, computer graphics and visualization in research and industrial settings.
The following is a list of relevant topics:
Topics (Papers and Research Notes)
- Mesh Generation and Modification
- Structured, unstructured, Cartesian, and hybrid meshing techniques
- High-order finite elements, and mesh generation
- Optimal meshing, centroidal Voronoi tessellation
- Mesh adaptation, metrics, and anisotropy
- Mesh refinement, coarsening, smoothing, untangling, optimization, simplification, and compression
- Dynamic mesh modifications such as moving meshes, level set methods, and mesh morphing
- Meshing for High-Performance and Distributed Computing
- Parallel mesh data structure
- Mesh partitioning and coloring
- Parallel meshing, mesh streaming, and real time meshing techniques
- Meshing for cloud computing
- CAD and Computational Geometry Issues for Meshing
- Geometry representation and translation: B-Rep NURBS, implicit surfaces, and volume data
- Surface reconstruction and domain generation
- Geometry preparation: CAD repair/cleanup, simplification, defeaturing, partitioning, decomposition, and imprint/merge
- Dimension reduction: medial axis transformation, Voronoi diagram, chordal axis transform, mid-surface, and other skeletal representations
- Virtual geometry and topology
- Implications of Applications for Meshing
- Finite element, finite volume analysis and modeling
- Geometric modeling
- Computer graphics and scientific visualization
- Other novel methodology and applications, such as isogeometric analysis
- Solution-driven adaptivity
- Application-specific novel meshing techniques
Paper and Research Notes Submissions
Papers Due: May 30, 2017
Paper submissions are now Open. Authors may register to submit papers by visiting the OpenConf website for IMR paper submissions. For instructions, see the paper submission webpage.
In addition to full papers, the 26th IMR also solicits research notes, which are short articles describing exploratory research, preliminary results and techniques deemed to be relevant to the field of meshing.
The guidelines for submitting research notes are as follows:
- The list of topics and formatting guidelines for research notes is the same as for the full paper.
- Research notes must be limited to 2000 words or 5 pages, whichever is shorter including figures, tables, references and appendices. Articles not meeting the formatting guidelines or page/word limit will be rejected.
- Research notes will be reviewed by the committee, with a less strict review standard than full technical papers.
- Research notes will not be published in the printed proceedings of the International Meshing Roundtable, but will be included in the electronic version of the proceedings, distributed on flashdrives with color figures.
- A special session will be dedicated to presentations of research notes. Presenters will have 10 minutes for presentation plus 5 minutes for questions.
- Authors may not submit a full paper and a research note on the same topic in the same year. However, a rejected full-paper submission may be recommended to beresubmitted as a research note for the year. Research notes from a previous year are eligible to be submitted as a full paper the following year.
Research Notes Due: August 8, 2017
For instructions, see the paper submission
Special Note: For accepted papers and research notes, at least one author must register for the IMR. Participants may be an author of multiple papers and research notes, but may be the presenting author of only one abstract. Each paid IMR registrant will be limited to one presentation (papers or research notes). Not limited to papers and research notes, all authors and presenters are encouraged to also submit posters and/or meshing contest entries.