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Cherri Porter
Conference Coordinator

cporter@sandia.gov
(505) 844-2788

21st International Meshing Roundtable Financial Support


21st IMR Financial Support for U.S. Students/Postdocs from ARO

Financial support from the U.S. Army Research Office (ARO) is available to student and postdoc attendees from US institutions to defray their travel expenses. Our budget allows to support up to 14 students and four postdocs. The ARO travel support will be on a reimbursement basis, and will be made to students and postdocs based on active research in mesh generation or interest in meshing related research topics. For each student awardee, the travel support will include

For each postdoc awardee, the support will include

Priority will be given to students and postdocs who will be presenting a paper, a research note or a poster at the conference, and those who will attend the short courses and the Professional Development Session at the conference.

A student or postdoc seeking financial support needs to submit the following documents.

  1. A one-page statement of interest signed by your advisor/supervisor or department chair/manager describing your interest in meshing related research, how the International Meshing Roundtable Conference will be helpful to your research, and how you will benefit by attending the conference. If you are presenting a paper, please include the title of your paper in the statement. If you are presenting a poster, please include a brief description of the research you will present in the poster.
  2. A photocopy of the student ID (students only).

Please send an electronic copy of these documents (as a single PDF attachment) to Dr. Xiangmin (Jim) Jiao at xiangmin.jiao@stonybrook.edu, with the subject line of “IMR-2012 ARO Travel Support Application”.

Applications for funding are due no later than 11:59pm MDT (UTC -6 hours) on August 30th, 2012. Decisions will be announced by August 31st, 2012. Further instructions for reimbursement will be sent via e-mail to the selected recipients at that time.

If you have questions on the application process, please send e-mail to xiangmin.jiao@stonybrook.edu

ARO

 



21st IMR Financial Support for European Students and Postdocs from the CEA

Limited financial support from the CEA is available to student and postdoc attendees from European institutions to defray registration expenses. The CEA travel support will be on fee-waiver basis, and will be made to students and postdocs based on active research in mesh generation or  interest in meshing related research topics. For each student awardee, the travel support will include

For each postdoc awardee, the support will include

Priority will be given to students and postdocs who will be presenting a paper, a research note or a poster at the conference, and those who will attend the short courses and the Professional Development Session at the conference.

A student or postdoc seeking financial support needs to submit the following documents.

  1. A one-page statement of interest signed by your advisor/supervisor or department chair/manager describing your interest in meshing research, how the International Meshing Roundtable Conference will be helpful to your research, and how you will benefit by attending the conference. If you are presenting a paper, please include the title of your paper in the statement. If you are presenting a poster, please include a brief description of the research you will present in the poster.
  2. A photocopy of the student ID (students only).

Please send an electronic copy of these documents (as a single PDF attachment) to Dr. Jean-Christophe Weill at jean-christophe.weill@cea.fr with the following subject line: “IMR-2012 CEA Travel Support Application".

Applications for funding are due no later than 11:59pm MDT (UTC-6 hours) on August 15th, 2012. Decisions will be announced by August 31st, 2012. Further instructions will be sent via e-mail to the selected recipients at that time.

If you have any question on the application process, please send e-mail to jean-christophe.weill@cea.fr.

CEA


 

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